About PECVD with Load Lock System
PECVD with Load Lock System is used for execution of plasma enhanced chemical vapor deposition procedure in semiconductor arena. Utilization of this system can also be noticed in microelectronics arena. Vacuum loadlock of this system has significant role in the production of low stress films. Liquid delivery source like tetraethylorthosilicate or TEOS is used during PCVVD procedure to promote deposition of doped as well as undoped silicon dioxide film. This entire process is carried out at low temperature and low internal stress based condition. PECVD with Load Lock System is equipped with ergonomic chamber and process controlling section for its production of standard quality film.
FAQs of PECVD with Load Lock System:
Q: What is the warranty period for the PECVD with Load Lock System?
A: The PECVD with Load Lock System comes with a 1-year warranty.
Q: What material is used in the construction of the PECVD with Load Lock System?
A: The PECVD with Load Lock System is constructed using mild steel.
Q: What is the primary usage of the PECVD with Load Lock System?
A: The PECVD with Load Lock System is designed for industrial usage.
Q: What is the power source for the PECVD with Load Lock System?
A: The PECVD with Load Lock System operates using an electric power source.
Q: What is the operational method of the PECVD with Load Lock System?
A: The PECVD with Load Lock System operates automatically.